Posted 26 Oct · 93 open roles
Silicon Packaging Design Engineer
India, BangaloreonsiteApply by 17 Nov 2026
- Undisclosed
- Salary
- 10+ yrs
- Experience
- Full time
- Job type
About the role
Job Description
Define packaging solutions for highly innovative integrated circuits, meeting adequate mechanical, thermal and electrical performance with the goal to achieve lowest package and system level cost. Co-design with chip designer, system engineering and PCB design teams during the development stage to optimize pad layout and pin map for most cost effective package and system. Independently plan, design and develop quality custom lead frame/substrate/module with supporting electrical simulation to reduce cross-talk, IR drop, and noise issues of the device. Technical lead for implementing packaging solutions at OSAT assembly site and/or internal assembly site. Ensure optimized…
Full details and the application are on Intel's careers site.
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Intel
93 open roles
Intel Corporation is an American multinational technology company headquartered in Santa Clara, California. It designs, manufactures, and sells computer components such as central processing units (CPUs) and related products for business and consumer markets. Intel was the world's third-largest semiconductor chip manufacturer by revenue in 2024 and has been included in the Fortune 500 list of the largest United States corporations by revenue since 2007. It was one of the first companies listed on Nasdaq.
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