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Intel

Posted 6 Oct · 61 open roles

Silicon Packaging Design Engineer

India, BangaloreonsiteApply by 29 Oct 2026

Undisclosed
Salary
Freshers welcome
Experience
Full time
Job type

About the role

Job Description

Join our team as a Silicon Packaging Design Engineer in the Data Center Group, where you will play a pivotal role in crafting cutting-edge silicon packaging solutions that drive Intel's innovation and technological leadership. In this role, you will be engaged in the end-to-end development of substrate designs, from concept to tapeout, ensuring optimized performance and manufacturability. Collaborating closely with cross-functional teams, your contributions will directly impact product quality, cost efficiency, and time-to-market for Intel's next-generation technologies. This is an exciting opportunity to start your career in a collaborative environment that fosters…

Full details and the application are on Intel's careers site.

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Intel

61 open roles

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What tech interviews usually cover

Common rounds for engineering roles. Every company runs its own process.

  1. Round 1

    Fundamentals

    Coding, data structures and problem solving, usually 45–60 minutes.

  2. Round 2

    Design and depth

    System or component design, plus the tools named in the posting.

  3. Round 3

    Team fit

    Past projects, how you work with others, and the offer conversation.

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Silicon Packaging Design Engineer at Intel, Bengaluru | Jobsearchers